​CPS Failure Analysis

​CPS FA Service is Available Now!!

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​SEM

Apreo_S

  • Structural analysis

  • Size measurement (CD, film thickness, angle, etc.)

  • Failure site isolation

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​SRP

SSM-2100

  • Quantify the amount of dopant activated

  • Deep Well/Junction depth analysis

  • Resistivity measurement for epi wafer

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FIB

Helios G4 CX

  • Top view/Cross-section inspection

  • Precision SEM/TEM sample preparation

  • Failure site isolation

  • Circuit Edit

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EMMI/OBIRCH

Thermofisher

  • Position the location of the failure

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​TEM

Talos F200X G2

  • Microstructure analysis (Profile/crystal/composition)

  • Measurement for very thin layer (gate oxide, etc.)

  • Elemental Analysis with EDX:

  • Spot, line scan, and mapping

  • Detection of element ranges from B to U

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C-AFM

Park

  • Detect the surface morphology of the sample and the electrical properties of the micro area

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Nano Prober

Thermofisher

  • Nano-probe technique, based on SEM platform,can be applied to measure the electrical parameters on device from source, gate, drain and ground contact.

  • ​EBAC (Electron Beam Absorbed Current) function is performed to measure open/or short on backend process

  • Apply EBIRCH (Electron Beam Induced Resistance Change) to isolate leakage location in nanometer

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​Optical Microscope

  • ​SEM/TEM Sample Preparation

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RIE

Oxford

  • ​Sample Preparation (de-process)