The BCM59121 contains eight low-RDS with on-chip, high-voltage pass-FETs, internal current
sense and an onboard microcontroller — all targeted to significantly reduce the complexity of
Power over Ethernet (PoE) and Power over Ethernet Plus (PoE+) designs while easing PCB layout.
The BCM59121 provides excellent protection under all possible fault conditions and overloads. It
also supports two-event Classification for Type 2 application
Process Technology: 0.13um, 1P5M
Die Size: 4.656mm ×4.327mm