MAX38803

The MAX38802/MAX38803 are fully-integrated, highly efficient switching regulators for applications operating from 6.5V to 14V input supplies that require up to 25A maximum load. These single-chip regulators provide a compact high-efficiency, power-delivery solution for precision outputs that demand fast transient response. The two devices have different programmability options (see Tables 3a and 3b for details) to enable a wide range of configurations. The programmable features include: internal/external reference voltage, output voltage setpoint, switching frequency, overcurrent protection level (OCP), and soft-start timing. Discontinuous current mode (DCM) operation can be enabled through pin-strapping to improve light-load efficiency. The MAX38802/MAX38803 include multiple protection and measurement features. Positive and negative cycleby-cycle OCP, short-circuit protection and overtemperature protection (OTP) ensure robust design. Input undervoltage and overvoltage lockout shut down the regulator to prevent damage when the input voltage is out of specification. Regulation is halted in case of an output overvoltage (OVP) event. A status pin indicates that the output voltage is within range and the output voltage is in regulation. The device has an analog output that can be configured to report output current or junction temperature with ±5% and ±8°C accuracy, respectively. The devices are available in a 27-bump (2.2mm x 3.8mm) WLCSP package that provides low thermal resistance and minimizes the PCB area

Evaluation report, including

1. the "ESTIMATED" process technology,
2. die size,
3. the "ESTIMATED" number of poly and metal layers
4. Die photos with low resolution

Evaluation only, the work scope of high-resolution chip imaging area and circuit analysis is opened to discussion

• If you decide to perform a circuit analysis, we will provide a complete delivery. including BrigenOne, EDIF format schematics, and PDF file
• The project is still in the "evaluation" phase, and the work scope is open to discussing.
• The information we provide about this project will be somewhat uncertain, as we have not yet performed high-resolution wafer images of each layer.