​Electrical Anomalies

In addressing electrical anomalies, semiconductor design companies can utilize the following instruments for fault analysis:

 

• Scanning Electron Microscope (SEM): Used to observe the chip's surface and microstructures, aiding in the identification of surface features that may cause electrical anomalies.

• Atomic Force Microscope (AFM): Provides high-resolution surface topography images, capable of detecting subtle surface variations, including structural abnormalities that lead to electrical issues.

• Energy Dispersive X-ray Spectroscopy (EDS): Combined with SEM, analyzes elemental composition to help determine material abnormalities causing electrical problems.

• Focused Ion Beam (FIB): Used to cut the chip and prepare cross-sectional views for further observation of the source of electrical anomalies.

• Oscilloscope: Used to observe and analyze voltage and current waveforms in circuits, aiding in the detection of potential electrical anomalies.

• Focused Ion Beam-SEM (FIB-SEM): Combines FIB and SEM functions, providing more detailed three-dimensional images to aid in locating and analyzing electrical anomalies.

• Thermal Evaporation System: Used to study material conductivity, helping to understand conductivity issues related to electrical anomalies.

 

The combined use of these instruments provides a comprehensive analysis of electrical anomaly issues, assisting in accurately identifying and resolving problems in the circuit.