Die imagery only
High-resolution layer-by-layer imagery with no schematic recovery. Cost here is driven mainly by area and layer count.
The most common question is "what does this part cost", and the most common assumption is that price follows die area. In reality only one of the three cost components scales with area. The other two do not.
Each has its own driver. Total cost is the sum of all three.
Driven by Die area
This one does scale with area. A larger die means more fields of view to capture and more stitching work.
Driven by Process node, metal composition and layer count
Independent of area. Advanced nodes, unusual metal chemistry or high layer counts each require re-tuning chemistry and parameters layer by layer.
Driven by Circuit complexity
Independent of area. A densely laid out analog IC can carry far more devices and connectivity than a physically larger digital part.
What sets the cost is not how big it is. It is how hard it is.
We do not publish a price list. The variation in engineering effort between chips is too large for an unevaluated figure to serve either as your budget or as our schedule.
Estimating cost is precisely what it exists for.
We need at least one sample. The evaluation report gives you die size, process node, metal and poly layer counts, and a top-layer photograph.
With the top-layer photograph in hand you can mark the region you want analysed, and we quote against exactly that. It is the least ambiguous way to agree scope.
The evaluation report is not engineering-verified and carries some margin of error, but it is sufficient to judge scale and feasibility.
If you go on to order the full circuit analysis report, the evaluation fee is deducted from its price.
One difference only: whether the report is ever supplied to anyone else. Who is reading it stays confidential either way.
| Model | Price | Afterwards | Best when |
|---|---|---|---|
| Non-Exclusive (default) | 1/3 | CPS may list and sell the report to other customers | you want the technology and a shorter development cycle, and do not mind the analysis being supplied to others later |
| Exclusive | 3× | Never resold; held only by the commissioning party | beyond the technology itself, you need certainty that competitors cannot obtain the same analysis |
About four in ten commissions choose Exclusive.
Whichever you choose, we never disclose who is reading a report — who commissioned the work, which chip they asked about, or when. This is not a paid upgrade; it is a line we have not crossed in eighteen years.
Partial scopes are equally welcome, and cost follows scope.
High-resolution layer-by-layer imagery with no schematic recovery. Cost here is driven mainly by area and layer count.
Devices and connectivity annotated, without assembling hierarchical schematics. Suited to teams whose own engineers will interpret the result.
Circle the region on the top-layer photograph and we analyse only that. Most first-time customers start here.
Or ship us a sample. After evaluation you get an accurate cost and schedule instead of a guess.